Printed Circuit Board Assemblies
Valuetronics has experience in many methods of printed circuit board assembly from through hole and mixed technology to customized fine pitched surface mount technologies.
Our process capabilities include:
- 01005 chips
- 0.4mm fine pitch IC
- Flip Chip
- CSPs
- BGAs and Micro-BGAs
- PoP (0.4mm pitch package on package)
- 3D Solder Paste Inspection (SPI)
- In-Circuit Test (ICT)
- Automatic Optical Inspection (AOI)
- X-Ray Inspection
Our
equipments include:
- 25 SMT lines (more than 50 millions chips placement/day)
- Lead Free Reflow ovens
- Lead Free Dual Wave machines
- Lead Free Selective Soldering machines
- Bonding machines
